Quectel Wireless Solutions unveiled its new FME163R Wi-Fi 6 and Bluetooth 5.2 module which features 2 x 2 MIMO connection capability and an M.2 2230 Key-E package at Embedded World, North America. Based on the Realtek RTL8852 chipset, this low-cost module features compact dimensions of 22.0mm x 30.0mm x 2.85mm, simplifying integration in to space-constrained designed. With high power consistency, ...
Quectel Wireless Solutions unveiled its new FME163R Wi-Fi 6 and Bluetooth 5.2 module which features 2 x 2 MIMO connection capability and an M.2 2230 Key-E package at Embedded World, North America. Based on the Realtek RTL8852 chipset, this low-cost module features compact dimensions of 22.0mm x 30.0mm x 2.85mm, simplifying integration in to space-constrained designed. With high power consistency, ...
Quectel Wireless Solutions unveiled its new FME163R Wi-Fi 6 and Bluetooth 5.2 module which features 2 x 2 MIMO connection capability and an M.2 2230 Key-E package at Embedded World, North America. Based on the Realtek RTL8852 chipset, this low-cost module features compact dimensions of 22.0mm x 30.0mm x 2.85mm, simplifying integration in to space-constrained designed. With high power consistency, ...
Quectel Wireless Solutions unveiled its new FME163R Wi-Fi 6 and Bluetooth 5.2 module which features 2 x 2 MIMO connection capability and an M.2 2230 Key-E package at Embedded World, North America. Based on the Realtek RTL8852 chipset, this low-cost module features compact dimensions of 22.0mm x 30.0mm x 2.85mm, simplifying integration in to space-constrained designed. With high power consistency, ...
Quectel Wireless Solutions unveiled its new FME163R Wi-Fi 6 and Bluetooth 5.2 module which features 2 x 2 MIMO connection capability and an M.2 2230 Key-E package at Embedded World, North America. Based on the Realtek RTL8852 chipset, this low-cost module features compact dimensions of 22.0mm x 30.0mm x 2.85mm, simplifying integration in to space-constrained designed. With high power consistency, ...
Quectel Wireless Solutions unveiled its new FME163R Wi-Fi 6 and Bluetooth 5.2 module which features 2 x 2 MIMO connection capability and an M.2 2230 Key-E package at Embedded World, North America. Based on the Realtek RTL8852 chipset, this low-cost module features compact dimensions of 22.0mm x 30.0mm x 2.85mm, simplifying integration in to space-constrained designed. With high power consistency, ...
Quectel Wireless Solutions unveiled its new FME163R Wi-Fi 6 and Bluetooth 5.2 module which features 2 x 2 MIMO connection capability and an M.2 2230 Key-E package at Embedded World, North America. Based on the Realtek RTL8852 chipset, this low-cost module features compact dimensions of 22.0mm x 30.0mm x 2.85mm, simplifying integration in to space-constrained designed. With high power consistency, ...
Quectel Wireless Solutions unveiled its new FME163R Wi-Fi 6 and Bluetooth 5.2 module which features 2 x 2 MIMO connection capability and an M.2 2230 Key-E package at Embedded World, North America. Based on the Realtek RTL8852 chipset, this low-cost module features compact dimensions of 22.0mm x 30.0mm x 2.85mm, simplifying integration in to space-constrained designed. With high power consistency, ...
Quectel Wireless Solutions unveiled its new FME163R Wi-Fi 6 and Bluetooth 5.2 module which features 2 x 2 MIMO connection capability and an M.2 2230 Key-E package at Embedded World, North America. Based on the Realtek RTL8852 chipset, this low-cost module features compact dimensions of 22.0mm x 30.0mm x 2.85mm, simplifying integration in to space-constrained designed. With high power consistency, ...
Quectel Wireless Solutions unveiled its new FME163R Wi-Fi 6 and Bluetooth 5.2 module which features 2 x 2 MIMO connection capability and an M.2 2230 Key-E package at Embedded World, North America. Based on the Realtek RTL8852 chipset, this low-cost module features compact dimensions of 22.0mm x 30.0mm x 2.85mm, simplifying integration in to space-constrained designed. With high power consistency, ...